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UP Core Plus is the 2nd Generation of modular developer boards from AAEON. The UP Core Plus developer board features a range of Intel processors to choose from including the Atom x5/x7, Celeron, and Pentium, formerly Apollo Lake. The UP Core Plus couples together up to 8 GB LPDDR4 memory and up to 128 GB of onboard eMMC storage, adding up to a low-power high-performance compact package. With support for WiFi and Bluetooth built in, the UP Core Plus is perfect for mobile applications.
The UP Core Plus give users and developers unmatched flexibility. It can be deployed as a standalone board, or paired up with carrier boards thanks to its two 100-pin connectors. With these two connectors, developers can add more power and capability to the UP Core Plus board with Net Plus and UP Vision Plus X boards from AAEON.
| Processor | Intel® Atom™ x5-E3930/x5-E3940/x7-E3950 Processor SoC |
| Graphics | Intel® HD 500 Graphics / x5-3900 Series Intel® HD 505 Graphics / x7-3900 Series |
| I/O | eDP x 1, DP x 1 Audio Port via HDMI and I2S (from docking) |
| Camera | CSI 2-Lane x 1 CSI 4-Lane x 1 |
| USB | USB 2.0 pin header x 2 USB3.0 OTG x 1 USB3.0 x 1 |
| Expansion | 100pin docking connector x 2 including: USB 2.0, USB 3.0, 6 PCI-E Lane, SATA, I2C, I2S, SPI, PWM, LPC, SDIO, HSUART, ISH, GPIO |
| RTC | YES |
| Power | 12V DC-in @ 3A -5A 5.5/2.1mm jack |
| Dimension | 56 mm × 90 mm |
| Memory | 2GB (single channel) LPDDR4 4GB/8GB (dual channel) LPDDR4 |
| Storage | eMMC 32 GB / 64 GB/ 128GB |
| Display Interface | eDP x 1, DP x 1 |
| Ethernet | — |
| OS support | Microsoft Windows 10 Professional, Microsoft Windows 10, IoT Core, Linux (Ubuntu, Yocto), Android 7.0 |
| Operating Temperature | 32°F ~ 140°F (0°C ~ 60°C) |
| Operating Humidity | 10% ~ 80% relative humidity, non-condensing |
| certificate | CE/FCC Class A, RoHS Compliant, REACH |
| Name | Type | Version | Release Date |
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